Understencil Wipes: Optimizing SMT Stencil Printing
Today’s video breaks down the latest research on optimizing SMT stencil printing. Dr. Adam discusses findings from a recent IPC APEX paper, revealing how solvent delivery systems, controlled contact time, and precise wipe sequences can significantly enhance print quality and reduce defects. Learn why slower gantry speeds and advanced solvent chemistries outperform traditional dry wipe methods, and discover actionable tips to expand your process window, improve yields, and achieve more reliable SMT printing results.