AQUANOX A4651US is a low pH cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. A4651US reduces the cavitation threshold, will completely remove flux residues from printed circuit assemblies and is compatible with a variety of metal components and substrates including aluminum and copper. AQUANOX A4651US cleans most lead-free, no-clean, rosin-based, and water-soluble flux residues consistently on assemblies.

AQUANOX A4651US provides bright and shiny solder joints with no sump side additives and cleans exceptionally well on the latest flux formulations. A4651US can be used “as-is” or diluted, dependent on the flux type. AQUANOX A4651US consistently and successfully provides exceptional cleaning results with minimal bath monitoring.

Product Data
Application: PCB Cleaning
Typical Process
Process: Ultrasonic
Concentration: SnPb Alloys ≤25%; Pb-Free Alloys ≤30%
Temperature: <150°F / 66°C
Rinse: Hot DI Water
Dry: Hot Air
Product Properties
pH (10g/L): 9.7
Flash Point: None to Boiling
Boiling Point: 210°F / 99°C
Water Soluble: Complete
VOC, @ 10% 55.1 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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