AQUANOX A8820 is an engineered Micro Cell Technology (MCT™) cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in surface mount printing processes. A8820 rapidly dissolves solder paste while maintaining material compatibility with coatings and stencils as well as materials of construction of common stencil cleaners.

AQUANOX A8820 is typically used for off-line stencil cleaning and may be used in spray-in-air and select ultrasonic stencil cleaning machines. A8820 does not require a rinse, is non-flammable, low in odor and fast drying.

Product Data
Application: Stencil Cleaning
Typical Process
Process: Spray-in-air & Select Ultrasonic Stencil Cleaners
Concentration: 25%
Temperature: Ambient to <120°F/49°C
Rinse: Optional
Dry: Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: >199°F / 93°C
Boiling Point: 291°F / 144°C
Water Soluble: Partial
VOC, @ 10% 88.5 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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