AQUANOX A8820D is a pour and go engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in surface mount printing processes. A8820D removes all un-reflowed solder paste using spray-in-air and select ultrasonic stencil cleaning machines with no rinsing required.

AQUANOX A8820D is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes and requires no mixing or monitoring. A8820D is a non-hazardous, non-flammable aqueous solution that contains no CFCs or HAPs.

Product Data
Application: Stencil Cleaning
Typical Process
Process: Spray-in-Air / Select Ultrasonic Stencil Cleaners
Concentration: Ready to Use
Temperature: Ambient to <120°F / 49°C
Rinse: Optional
Dry: Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: None to Boiling
Boiling Point: 216°F / 102°C
Water Soluble: Soluble
VOC, @ 100% 221 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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