CYBERSOLV 141-X dissolves rosin and low residue flux residues and then readily evaporates after the cleaning application. CYBERSOLV 141-X is designed for bench-top cleaning needs and is ideally suited for cleaning through-hole and SMT electronic assemblies, connectors, cables, and hybrid circuits. The product is excellent for spot cleaning flux and is commonly used to clean solder joints following hand soldering. After cleaning, a rinse using fresh CYBERSOLV 141-X is required for a residue and flux free assembly.

The solvents that makeup CYBERSOLV 141-X are low in odor, toxicity and non-ozone depleting and EPA SNAP approved. CYBERSOLV 141-X also meets RoHS and REACH directives. While effective on many NC and Rosin flux formulas, the product is not recommended for cleaning WS (OA) fluxes. CYBERSOLV 141-X is available in bulk liquid packaging.

Product Data
Application: PCB Cleaning
Typical Process
Process: Manual
Concentration: 100%
Temperature: Ambient
Rinse: No Rinse Required
Dry: Wipe Optional
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: None to Boiling
Boiling Point: 116°F/47°C
Water Soluble: Negligible
VOC, @ 100% 1175 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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