CYBERSOLV C8508 is an aqueous based cleaner for reflow ovens and general equipment maintenance. C8508 effectively removes adherent residues outgassed during the reflow-soldering step of surface mount assemblies that includes solder paste activators and functional additive build-up. CYBERSOLV C8508 is extremely effective at removing the toughest baked-on flux residues including the latest lead-free formulations.

CYBERSOLV C8508 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes, including tools and accessories made of aluminum, copper and brass materials. C8508 is an excellent preventative maintenance product and is ideal for cleaning all soldering equipment types on the assembly floor.

Product Data
Application: MAINTENANCE
Typical Process
Process: Manual, Spray or Immersion
Concentration: 100%
Temperature: Room Temperature
Rinse: Clean Wet Cloth
Dry: Air
Product Properties
pH (10g/L): 10.7
Flash Point: None to Boiling
Boiling Point: 221°F / 105°C
Water Soluble: Complete
VOC, @ 100% 299 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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