CYBERSOLV C8622 is a full-strength solvent blend specifically designed as an IPA alternative for under stencil wiping and manual bench top cleaning applications. C8622 is ideally suited for dissolving un-reflowed solder paste during the stencil printing process, and can be applied as received in any application where IPA is typically used.

CYBERSOLV C8622 improves stencil printing yields by removing trace solder paste deposits from the stencil aperture. C8622 is safe and effective in all IPA applications, boasting extensive compatibility and low odor. CYBERSOLV C8622 dries spot free and does not require a rinsing step, however, if needed, use fresh C8622 or Hot DI Water.

Product Data
Application: STENCIL CLEANER
Typical Process
Process: Manual & Stencil Wipe
Concentration: 100%
Temperature: Ambient
Rinse: None Required
Dry: Air
Product Properties
pH (10g/L): 5.7
Flash Point: 147°F / 64°C
Boiling Point: 217°F / 103°C
Water Soluble: Complete
VOC, @ 100% 296 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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