CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.

CYBERSOLV C8882 has a mild solvent odor, quickly dissolves all flux constituents within the solder paste and will not adversely affect stencils that have been nano-coated. C8882 has been proven compatible with all wetted components in automated understencil wipe systems and approved for use by several printer manufactures’. CYBERSOLV C8882 is fast drying without leaving behind any residue.

Product Data
Typical Process
Process: Understencil, Hand-held Ultrasonic Cleaner & Manual
Concentration: 100%
Temperature: Ambient
Rinse: Optional
Dry: Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: 142 °F / 61 °C
Boiling Point: 270°F / 132°C
Water Soluble: Partial
VOC, @ 100% 875.6 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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