IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents and inhibitors. FCR is engineered to remove organic acid, rosin and no-clean flux residues from electronic assemblies, advanced packages, hybrid and SMT substrates. IONOX FCR is used as received, in semi-aqueous centrifugal, spray under immersion, ultrasonic or mega-sonic tools, and should be followed with a water rinse to remove all traces of soils and cleaner residues from substrate surfaces.

IONOX FCR is an environmentally friendly, naturally derived, biodegradable cleaning agent. FCR is effective on a wide variety of soils, offers a low cost of ownership and long bath life. It has a low vapor pressure, which reduces concerns of flammability and smell. IONOX FCR has complete water solubility, which enhances the ease of rinsing and removal of ionic contamination. It has been used within the industry for over 25 years and has a long heritage of successful use.

Product Data
Application: PCB CLEANING
Typical Process
Process: Immersion
Concentration: 100%
Temperature: 140°F / 60°C
Rinse: DI Water
Dry: Hot Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: 163°F / 73°C
Boiling Point: 352°F / 178°C
Water Soluble: Complete
VOC, @ 100% 1045 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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