IONOX I3302 is a semi-aqueous cleaning agent designed for cleaning the most challenging SMT Pb-free solder paste and tacky flux paste residues. This solution is also safe and effective for use on the newest Sn/Bi solder paste formulas.  I3302 is highly effective at removing baked-on flux residues, which is particularly beneficial when cleaning lead frames, packages, and high-lead alloys. IONOX I3302 is designed for semi-aqueous centrifugal, spray under immersion, ultrasonic and mega-sonic tools, and should be rinsed with DI water or IPA.

IONOX I3302 is environmentally friendly and compatible with cleaning equipment and most materials of construction commonly used in electronics manufacturing. I3302 is a non-hazardous, biodegradable cleaning agent that provides a long bath life for your process. IONOX I3302 is completely water-soluble which enhances rinsing and the removal of ionic contamination.

Product Data
Application: PCB Cleaning
Typical Process
Process: Immersion
Concentration: 100%
Temperature: <140°F / 60°C
Rinse: DI Water or IPA
Dry: Hot Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: 180°F / 82°C
Boiling Point: 302°F / 150°C
Water Soluble: Complete
VOC, @ 100% 1035 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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