KYZEN E5321-LF is a room temperature pallet and maintenance cleaning agent specifically designed to remove flux residues from wave solder pallets, reflow oven filters, spray nozzles, air bubbling diffusion bars, and other assembly hardware used to solder and reflow printed circuit assemblies. E5321-LF will clean most residues in the 3-5% concentration range however, baked on and hardened lead-free high temperature flux residues may require higher concentrations.

KYZEN E5321-LF is formulated to minimize the foaming potential that can be caused by some organic acid soils in batch spray systems. E5321-LF has a broad material compatibility matrix including PVC plumbing. NOTE: KYZEN Booster 20 is available to increase effectiveness and compatibility of KYZEN E5321-LF for parts with aluminum hardware.

Product Data
Typical Process
Process: Spray, Ultrasonic, and Soak
Concentration: Pallets: 3-10% Maintenance: 5-10%
Temperature: Ambient to 104°F/40°C
Rinse: Recommended DI Water
Dry: Hot Air
Product Properties
pH (10g/L): 11.2
Flash Point: None to Boiling
Boiling Point: 223°F / 106°C
Water Soluble: Partial
VOC, @ 10% 56.0 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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