KYZEN E5322 is engineered to effectively and efficiently perform off-line maintenance cleaning of your wave solder, reflow oven systems, and associated tooling. E5322 removes even the most difficult fluxes and solder pastes in commonly used immersion cleaning systems and has excellent material compatibility including: aluminum, copper and steel.

KYZEN E5322 has had successful results with minimal exposure time. E5322 helps reduce maintenance and machine down time while increasing production and reducing overall cost while having a long bath life and low odor.

Product Data
Typical Process
Process: Immersion & Soak
Concentration: Pallets: 10-20% Maintenance: 15-25%
Temperature: ≤150°F/65°C
Rinse: Recommended DI Water
Dry: Hot Air
Product Properties
pH (10g/L): 11.4
Flash Point: None to Boiling
Boiling Point: 216°F / 102°C
Water Soluble: Complete
VOC, @ 10% 3.1 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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