KYZEN E5325 is used in multiple applications to effectively and efficiently perform off-line maintenance cleaning to remove even the most difficult fluxes and solder pastes from pallets, wave solder fingers, reflow oven parts and associated tooling. E5325 has proven compatible with aluminum, copper, and steel as well as standard materials used in reflow oven systems, wave solder, and associated tooling.

KYZEN E5325 is a low odor solution that delivers successful results with minimal exposure time. E5325 will reduce maintenance and machine downtime therefore increasing production and reducing overall cost. KYZEN E5325 has no VOCs making it a great choice as an environmentally friendly chemistry.

Product Data
Typical Process
Process: Spray-In-Air, Immersion and Ultrasonic Systems
Concentration: Pallets: 5-10% Maintenance: 5-25%
Temperature: Ambient to 140°F/60°C
Rinse: Optional / DI Water
Dry: Hot Air
Product Properties
pH (10g/L): 11
Flash Point: None to Boiling
Boiling Point: 217°F / 103°C
Water Soluble: Complete
VOC, @ 10% 0.0 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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