KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologies, including water soluble, rosin, low residue and synthetic flux compositions. KYZEN E5611 is also effective at removing uncured SMT adhesives used to hold passive components prior to soldering.

KYZEN E5611 is designed for use in aqueous spray-in-air and ultrasonic stencil cleaning machines and is effective at low concentrations and ambient temperature. E5611 is uniquely designed to allow the product to be applied without rinsing however, rinsing with DI water following the cleaning process is recommended. The wash concentration of KYZEN E5611 depends on the soil type and levels of solvency needed to dissolve resin binder present in flux and adhesive compositions.

Product Data
Typical Process
Process: Spray & Ultrasonic
Concentration: <25%
Temperature: Ambient to 120°F/49°C
Rinse: Recommended DI Water
Dry: Hot Air
Product Properties
pH: N/A (Solvent-Based)
Flash Point: None to Boiling
Boiling Point: 217°F / 103°C
Water Soluble: Partial
VOC, @ 10% 83.2 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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