KYZEN E5615 is an aqueous-based cleaner designed to be the fastest drying chemistry in the industry. E5615 is engineered to reduce stencil underwipe coefficient of variation and improve solder paste release. KYZEN E5615 is shipped ready to use and successfully removes raw solder paste from stencils and related equipment.

KYZEN E5615 is a pH neutral cleaning agent that has no flash point to boiling. This product is an ideal replacement for IPA (isopropyl alcohol). E5615 is effective on water soluble, rosin and many no-clean solder paste products. KYZEN E5615 contains no non-volatile ingredients within the formulation, and as such, requires no solvent or water rinsing.

Product Data
Typical Process
Process: Spray, Immersion, Underscreen & Manual Wipe
Concentration: Ready to Use
Temperature: Ambient
Rinse: None Required
Dry: Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: None to Boiling
Boiling Point: 199°F / 93°C
Water Soluble: Complete
VOC, @ 100% 257.0 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

Fields marked with * are required
Product Supplement
A Representative to Contact Me
Please see comments below
Fields marked with * are required

Process Care Center

Improve productivity with advanced products and services that monitor, manage and control your cleaning processes.