MICRONOX MX2100 is an aqueous, single-phase solvent designed to remove tough flux residue from PMIC devices including IGBT modules and power MOSFETs. MX2100 has a well-balanced formula that provides outstanding cleaning performance and metal compatibility, and leaves great metal surface condition for post wire bonding and EMC process. It’s designed to be effective in In-Line SIA.

PMIC devices exposed metalization is susceptible to cleaning agent attack on the aluminum pads, exposed copper, nickle and high lead alloy. MICRONOX MX2100 intermolecular attractive forces for polar and non-polar organic acid flux residues allow for rapid dissolution of the flux residue. The low level of free alkalinity in combination with corrosion inhibition technology protect exposed metals from cleaning agent attack while still allowing post-cleaning wire bonding.

Product Data
Application: Wire Bonding Cleaning
Typical Process
Process: Spray-in-Air
Concentration: 15-25%
Temperature: <149°F / 65°C
Rinse: Ambient DI Water
Dry: Ambient Air
Product Properties
pH (10g/L): 9.1
Flash Point: None to Boiling
Boiling Point: 204°F / 96°C
Water Soluble: Complete
VOC, @ 10% 54.3 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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