MICRONOX MX2100 is an aqueous, single-phase solvent designed to remove tough flux residue from PMIC devices including power MOSFET and IGBT. MX2100 is effective at low concentration that provides outstanding cleaning performance and metal compatibility and leaves great surface condition for post wire bond and EMC processes. It’s designed to be applied in in-line SIA and remove flux residues under flip chip.

PMIC devices exposed metalization is susceptible to cleaning agent attack on the aluminum pads, exposed copper, nickle and high lead alloy. MICRONOX MX2100 intermolecular attractive forces for polar and non-polar organic acid flux residues allow for rapid dissolution of the flux residue. The low level of free alkalinity in combination with corrosion inhibition technology protect exposed metals from cleaning agent attack while still allowing post-cleaning wire bonding.

Product Data
Application: Wire Bonding Cleaning
Typical Process
Process: Spray-in-Air
Concentration: 15-25%
Temperature: <149°F / 65°C
Rinse: Ambient DI Water
Dry: Ambient Air
Product Properties
pH (10g/L): 9.1
Flash Point: None to Boiling
Boiling Point: 204°F / 96°C
Water Soluble: Complete
VOC, @ 10% 54.3 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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