MICRONOX MX2120 is an aqueous, single-phase solvent designed to remove tough flux residue present after die-attach on DBC substrates. MX2120 has a well-balanced formula that provides outstanding cleaning performance and metal compatibility, and leaves great metal surface conditions for both post wire bonding processes and EMC processes. It is designed to be effective in in-line SIA cleaning systems and is easily monitored and controlled. It can also be used with in-line spray-in-air washers.

DBC device exposed metalization is susceptible to cleaning agent attack on the aluminum pads, exposed copper pillar, nickel and high lead alloy. MICRONOX MX2120 effectively cleans flux residues present after the die-attach process and oxidation from the exposed metals. The low level of free alkalinity in combination with corrosion inhibition technology protects exposed metals from cleaning agent attack while still allowing high yields for post-cleaning wire bonding. MX2120 also offers longer bath life at low concentrations.

Product Data
Application: Aqueous Single-Phase Cleaner
Typical Process
Process: Spray-in-Air
Concentration: 15-25%
Temperature: 122 °F / 50 °C
Rinse: Ambient DI Water
Dry: Ambient Air
Product Properties
pH (10g/L): 8.3
Flash Point: None to Boiling
Boiling Point: 219°F / 104°C
Water Soluble: Partial
VOC, @ 10% 76.7 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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