MICRONOX MX2127 is an aqueous, single-phase and well-balanced chemistry designed to remove lead-free flux residues from all types of IGBT module devices that utilize copper and nickel DBC as substrates. It performs well on removal of common no-clean flux residue at low concentration and low temperature as well as leaves a nice and shiny aluminum bond pad and DBC surface after cleaning for post wire bond process. With a balanced formula, MX2127 is also compatible with anti-oxidation materials, commonly known as OSP. MX2127 is designed to be used and easily monitored in in-line SIA cleaning system.

MICRONOX MX2127 has also shown stable cleaning performance and long bath life for low cost ownership. After used, MX2127 is easy to handle for waste treatment with its gentle properties. By specializing the formula, MX2127 is made as a multi-metal safe, cost effective and universal cleaning agent to meet all the requirements of cleaning IGBT module devices.

Product Data
Application: Wire Bonding Cleaning
Typical Process
Process: Spray-in-Air
Concentration: 15-25%
Temperature: 122°F / 50°C
Rinse: Ambient DI Water
Dry: Ambient Air
Product Properties
pH (10g/L): 8.2
Flash Point: >219°F / >104°C
Boiling Point: 232°F / 111°C
Water Soluble: Partial
VOC, @ 10% 83.3 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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