MICRONOX MX2150 is a used as received cleaning agent that is designed to remove flux residues from Camera Module (CMOS, CCD) assemblies. MX2150 is effective on a broad range of Pb-free process flux residues in ultrasonic systems, and preserves shine on solder joints. Designed with a gentle formula, MICRONOX MX2150 provides excellent compatibility with FFC, FPC, and all metals. It is easy to use, rinses easily and completely, with a low cost of ownership.

MICRONOX  MX2150 offers metal compatibility with SAC305, SN100, and lead-free bismuth solder alloys. MX2150 is engineered with a mixture of functional additives that are added to protect metallic surfaces from chemical attack, surface tension reduction to improve wetting and penetration under low gap components, and reduce foam propagation. The features engineered into MX2150 make for a highly effective ultrasonic cleaning product. The product has a wide material compatibility window on all electronic packaging substrates

Product Data
Application: Ultrasonic Systems
Typical Process
Process: Ultrasonic Systems
Concentration: 100%
Temperature: <149°F / 65°C
Rinse: Ambient DI Water
Dry: Hot Air
Product Properties
pH: 9.8
Flash Point: None to Boiling
Boiling Point: 202°F / 94°C
Water Soluble: Complete
VOC, @ 100% 272

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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