MICRONOX MX2180 is designed to remove minor residual pressure sensitive adhesives (PSA) from UV and blue tapes post wafer grinding and wafer dicing process. MX2180 is effective in ultrasonic and spray-in-air systems with low concentration.

MICRONOX MX2180 provides excellent compatibility with a broad range of materials such as silicone/glass base substrates, passivation layers and all types of solder joints. This product is designed to be diluted and is capable for use in ultrasonic or spray cleaning processes.

Product Data
Application: Tape Residue Removal
Typical Process
Process: Ultrasonic & Spray
Concentration: <30%
Temperature: 123-158°F/50-70°C
Rinse: DI Water
Dry: Hot Air
Product Properties
pH (10g/L): 10.7
Flash Point: None to Boiling
Boiling Point: >208°F/>98°C
Water Soluble: Complete
VOC, @ 10% 0.0 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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