MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all immersion cleaning systems including; semi-aqueous centrifugal, spray under immersion, ultrasonic and mega-sonic systems. MICRONOX MX2302 is compatible with all soldering materials and metal layers as well as materials of construction common in the production and cleaning of assemblies.
A major benefit of MICRONOX MX2302 is its complete water solubility, which enhances the ease of rinsing and removal of ionic contamination. MX2302 has a low vapor pressure that reduces concerns of flammability and smell. MICRONOX MX2302 has a low surface tension of 20-26 dynes/cm improving cleaning under the Z-axis of the component or package and is buffered to maintain a stable pH.
Application: WAFER BUMPING CLEANING
NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.