MICRONOX MX2302DT is a semi-aqueous chemistry for high lead applications where longer cleaning process times are required. MICRONOX MX2302DT has an enhanced inhibition package that allows for longer process times without damaging delicate substrates.

Easy to use, MICRONOX MX2302DT has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers. MX2302DT is used at full strength in all immersion systems to remove difficult flux and paste residues from advanced assemblies and followed by a DI water rinse. MICRONOX MX2302DT is a biodegradable, non-flammable, non-corrosive solvent that contains no CFCs or HAPs.

Product Data
Application: WIRE BONDING
Typical Process
Process: Immersion Systyems
Concentration: 100%
Temperature: <130°F / 54°C
Rinse: DI Water Rinse
Dry: Hot Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: 163°F / 73°C
Boiling Point: >239°F / 115°C
Water Soluble: Complete
VOC, @ 100% 1034 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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