MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.

MICRONOX MX2322 is used as received and rinses quickly and cleanly with DI water. MX2322 has a wide process window, as well as a long bath life providing a low cost of ownership. MICRONOX MX2322 has proven superior compatibility on exposed sensitive metals including aluminum, copper and nickel as well as passivation materials.

Product Data
Application: Back End Wafer and Wire Bonding
Typical Process
Process: Immersion Systems
Concentration: 100%
Temperature: 145°F / 63°C
Rinse: DI Water Rinse
Dry: Hot Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: 208°F / 98°C
Boiling Point: 343°F / 173°C
Water Soluble: Partial
VOC, @ 100% 1001 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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