Reflow OvenBuilt-up flux residues inside reflow ovens can cause problems in the reflow process, which can include three main issues:

  1. Flux residues dripping on PCBs from interior oven surfaces.
  2. Decreased performance of the reflow oven due to improper air flow via convection.
  3. The fingers of the chains inside the reflow oven can become damaged by excessive flux residue causing the printed circuit boards to be improperly cleaned.

To help remedy these problems, KYZEN has developed a special line of products that carry the CYBERSOLV brand name. These products can be used to clean the entire inside and outside surfaces of your reflow system. Its ease of use and high cleaning power makes it one of the top maintenance cleaning chemistries in KYZEN’s tool belt.

While the line is known for its effective performance cleaning, it’s still good to understand how the two products work and which is best for your reflow oven cleaning needs:

CYBERSOLV C8502

  •  Quickly removes all flux residues
  • Virtually no odor
  • Non-flammable alternative to IPA
CYBERSOLV C8508

  • Heavy-duty cleaner
  • Safe on aluminum, copper, and brass
  • Requires water wipe after use

Need to clean your flux filters in line with traps and condensers? Keep your reflow oven working at peak efficiency with another KYZEN maintenance cleaner, KYZEN E5322.

After cleaning these traps and filters, you will achieve improved performance of your reflow oven and a more robust reflow profile.

Process Care Center

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