Most solder defects, some estimate up to 70%, can be attributed to the stencil printing process. KYZEN can improve your stencil cleaning efficiency with our specially formulated stencil cleaners, which will improve process yields.
Why is stencil cleaning becoming more critical?
As miniaturization drives electronic component size ever smaller, the more important it has become that solder paste deposits and volume transfer are consistent and reproducible from board to board in the printing process. A number of factors can negatively affect these important attributes. For example, proper solder paste transfer efficiency is especially critical for small pad features, because it reduces defects due to poor solder joints. In this case, solder paste builds up onto the aperture walls and bottom side of the stencil over time leading to insufficient or inconsistent transfer onto the pads. Periodic cleaning of the built up paste with a KYZEN stencil cleaning fluid designed for your application will improve print quality and process yield.
Selecting the right stencil cleaning agent or stencil cleaner
Choosing the best stencil cleaning agent or stencil cleaner is a function of matching the right KYZEN material to your stencil cleaning method and your stencil cleaning equipment.
Stencil Cleaning Methods:
- Understencil Wipe
- Hand Wipe
- Hand Held Ultrasonic Transducer
- Ultrasonic Immersion / Water Rinse
- Ultrasonic Immersion / Filtered Cleaning Agent Rinse
- Spray-in-Air Solvent Wash / Solvent Rinse
- Spray-in-Air Aqueous Wash / Water Rinse
- Spray-in-Air Aqueous Wash / Cleaning Agent Rinse
Stencil Cleaning Agent Guide
KYZEN’s array of stencil cleaning products is specifically formulated for all common stencil cleaning methods. The table below simplifies the selection process by matching the stencil cleaning agent to the process.