KYZEN can improve your cleaning efficiency with our specially formulated stencil cleaners, which will improve process yields. Most solder defects, some estimate up to 70%, can be attributed to the stencil printing process.

image of a stencil before and after cleaning

A clean stencil can be critical

As PCB assemblies become denser and miniaturization drives electronic component size ever smaller, the more important it has become that solder paste deposits and volume transfer are consistent and reproducible from board to board in the printing process. A number of factors can negatively affect these important attributes.

For example, proper solder paste transfer efficiency is especially critical for small pad features, because it reduces defects due to poor solder joints. In this case, solder paste builds up onto the aperture walls and bottom side of the stencil over time leading to insufficient or inconsistent transfer onto the pads. Periodic cleaning of the built-up paste with a KYZEN cleaning fluid designed for your application will improve print quality and process yield.

Select the right cleaning chemistry

Choosing the best cleaning agent or stencil cleaner is a function of matching the right KYZEN material to your cleaning method and your cleaning equipment.

Stencil Cleaning Methods

Depending on your manufacturing process needs, choosing the best cleaning method can be key. Whether it is manual (hand wipe), on printer (under stencil wipe) or an off-line cleaning machine process, KYZEN will work with you to make sure you get the best solder print and placement.

Cleaning Agent Guide

KYZEN’s array of stencil and misprinted PCB cleaning products for stencils is specifically formulated for all common cleaning methods.  The table below simplifies the selection process by matching the cleaning agent to the process.

CLEANING METHOD AQUANOX A8820 AQUANOX A8830 KYZEN E5631 KYZEN E5631J CYBERSOLV C8882
On Printer Understencil Wipe
Off-Line Stencil Cleaning Spray Systems
Off-Line Stencil Cleaning Ultrasonic Systems
Off-Line Manual
Off-Line Hand-Held Ultrasonic Cleaning
The understencil wipe process begins with a roll of fibrousmaterial that is used, as the name implies, for wiping across the underside of the stencil and removing soils.
Ultrasonic stencil cleaning is one of the preferred methods for removing trace levels of solder paste from stencil openings.
Cybersolv® C8882 is a solvent-based stencil cleaning fluid specifically designed to clean wet solder paste, SMT adhesive and flux residue from stencils (conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees.
The desirable properties of a stencil cleaning agent are (1) the ability to rapidly dissolve the solder paste flux vehicle, (2) material compatibility with the nano-coating and equipment, (3) non-flammable, (4) low odor, and (5) rinse with water or cleaning agent.
Cleaning the Stencil as it comes from the printer is necessary to remove trace levels of solder paste from the apertures. Automated stencil cleaning machines are highly effective at thoroughly cleaning stencils.
Misprint cleaning is commonly addressed by either hand wiping the misprinted side of the circuit card and/or cleaning the misprint in a stencil cleaning machine. Cleaning misprinted boards can offer challenges in both methods.

Process Care Center

Improve productivity with advanced products and services that monitor, manage and control your cleaning processes.

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