CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean wet solder paste, SMT adhesive and flux residue from stencils (conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees. C8882 dissolves the flux vehicle, which allows solder balls to release from the stencil during the stencil printer wipe sequence. For solvent-based stencil cleaning machines normally designed to process IPA, Cybersolv C8882 can be processed in both spray-under-immersion and spray-in-air designs. Cybersolv C8882 has a flash point over 60°C and evaporates cleanly from the stencil.
CYBERSOLV C8882 is effective for use within the following cleaning processes:
- Understencil Wipe Cleaning – C8882 solvates the flux resin compositions within uncured solder pastes effectively cleaning and removing solder paste that sticks to aperture walls and the bottom of the stencil. Following the wipe process, a dry wipe and vacuum process rapidly dry the stencil following the cleaning process.
- Hand wipe, Immersion Stencil and Pallet Cleaning – The selection of solvents used in CYBERSOLV C8882 effectively remove polar and non-polar soils. C8882 can be used to hand wipe a stencil following the printing process.
- Semi-Manual Ultrasonic Stencil Cleaning Systems – CYBERSOLV C8882 is an effective cleaning agent for use with the GEN3 and SAWA ultrasonic absorption mat stencil cleaning systems.
- Solvent Stencil Cleaning Spray Systems – Cybersolv C8882 effectively washes and rinses stencils and is designed to run in solvent spray-under-immersion and spray-in-air cleaning machines that were commonly designed to clean with IPA.
PROCESS PARAMETERS FOR SOLVENT STENCIL CLEANING SPRAY SYSTEMS
Step 1: Charge the machine with 100% C8882. No heat is required.
Step 2: Program the machine for the wash cycle time of roughly 2-4 minutes.
Step 3: Following the wash process, the stencil is rinsed with filtered C8882.
Step 4: Allow stencil cleaning fluid to evaporate from the stencil’s surface.