Most off-line spray-in-air stencil cleaning systems are designed for use with aqueous or semi-aqueous cleaning chemistries. These stencil cleaning systems typically use a single chamber for washing and rinsing. Selecting the right chemistry will provide clean stencils, clear apertures and extend the life of your stencil.

Tips for Selecting Off-Line Stencil Cleaner for Spray-in-Air Systems

The desirable qualities for a good stencil cleaning chemistry for spray-in-air machines include: Clean stencil after Spray-in-Air

  • Low VOC
  • Able to rapidly dissolve solder paste
  • Low odor or odorless
  • Non-flammable
  • Remove solder paste from small apertures
  • Compatible with mesh and aluminum frames
  • Rinse with water or cleaning agent

 

KYZEN offers KYZEN E5631 as a low concentration aqueous solution formulated with the worker and environment in mind. KYZEN E5631 is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints.

 

Steps for Running Aqueous Spray-In-Air Stencil Cleaning Process

Step 1: KYZEN E5631: Charge the cleaning machine with 75-85% water and 15-20% E5631. No heat is required.

Step 2: Program the machine for the wash cycle time of roughly 5 minutes.

Step 3: After the wash process, the stencil is rinsed with either the filtered cleaning agent or water.

Step 4: Program the machine with the needed dry cycle time.

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