NASHVILLE — April 25, 2016 — KYZEN is pleased to announce that Dr. Mike Bixenman will teach a workshop and present a paper during the SMTA International Conference on Soldering and Reliability (ICSR), scheduled to take place May 9-11, 2016 in Toronto Canada.
The workshop entitled, “Designing in Reliability by Assessing Contamination at the Component Interface,” will address how gaining a better understanding of no-clean residues, their potential to cause leakage, and test methods for quantifying risk will help reliability engineers understand how clean is clean enough to meet reliability requirements.
This course is recommended for OEM quality engineers, design engineers, process engineers over cleaning, and test engineers.
Additionally, during his presentation entitled, “Why Clean No-Clean Flux,” Dr. Bixenman will discuss how understanding cleanliness data becomes more challenging as circuit assemblies increase in density. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods.
Dr. Mike Bixenman, CTO of KYZEN, has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
For more information about ICSR or to register for the event, visit http://www.smta.org/icsr/register_now.cfm.
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards.