The Science Lab
How to Optimize Your Aqueous Inline Process
One of the initial steps in the implementation of any successful cleaning program is understanding how to consistently apply the cleaning agent to the soil matrix while maintaining long-term control of the manufacturing process. Several factors contribute to the stability and continued success of any aqueous cleaning process.
They all begin with the proper set up and adjustment or “Base Lining” of the inline cleaner. This simple often overlooked exercise will go a long way to ensuring long-term success. Such factors and exercises are crucial to ensuring your aqueous inline is at peak performance but understanding where to begin can be challenging. Luckily, our KYZEN cleaning experts have taken the time to provide a step-by-step guide to ensure your system is optimized from start to finish.
To gain access to this exclusive content, simply click here. And as always, if you have any questions for our team, don’t hesitate to let us know!
Cleaning Solutions for Every Process
No matter what product or process you are working with, KYZEN has the solutions that could work for you. For over 30 years we have been helping customers enhance their process from start to finish. While we have worked with and developed many chemistries over the years, you might be wondering what our top picks are currently. We’ve got you covered!
Here is a small overview of our recommendations for PCB, Stencil, and Maintenance cleaning:
AQUANOX A4727: An electronics assembly cleaning solution that provides exceptional results when cleaning printed circuit boards and advanced packaging assemblies. Its advanced technology gives a stable pH, superior risibility, and predictable compatibility throughout its long bath life.
AQUANOX A4382: A near-neutral range pH chemistry designed with superior cleaning efficacy with great material compatibility on surface mount assemblies. It is formulated as a concentrate and designed to work in spray-in-air aqueous cleaning machines. A4382 is low in odor and contains no hazardous materials. It has a wide material compatibility window and is specifically designed for use on printed circuit board hardware.
AQUANOX A4625: AQUANOX A4625 is a highly dispersive cleaning agent designed to clean electronic assemblies in spray-in-air cleaning equipment. A4625 is effective on greater than 90% of the solder pastes in production today and is commonly used to clean lead-free and no-clean flux types but will also clean water-soluble soils.
CYBERSOLV 141-R: This product dissolves rosin and low residue flux residues and then readily evaporates after the cleaning application. CYBERSOVLV 141-R is designed for bench-top cleaning needs and is ideally suited for cleaning through-hole and SMT electronic assemblies, connectors, cables, and hybrid circuits. The product is excellent for spot cleaning flux and is commonly used to clean solder joints following hand soldering.
KYZEN E5631: KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints.
CYBERSOLV C8882: CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.
KYZEN E5322/E5325: KYZEN E5322 is engineered to perform off-line maintenance cleaning of your wave solder effectively and efficiently, reflow oven systems, and associated tooling. KYZEN E5325 is used in spray-in-air applications to effectively and efficiently perform off-line maintenance cleaning to remove even the most difficult fluxes and solder pastes from pallets, wave solder fingers, reflow oven parts and associated tooling
CYBERSOLV C8502/C8508: CYBERSOLV C8502 is specially formulated to quickly remove all types of flux residues from wave solder fingers, reflow oven surfaces and general electronics production equipment. CYBERSOLV C8508 is an aqueous based cleaner for reflow ovens and general equipment maintenance. This product effectively removes adherent residues outgassed during the reflow-soldering step of surface mount assemblies that includes solder paste activators and functional additive build-up.
To download this information for yourself, click here. Additionally, keep in mind that these are only a few of our top chemistries, but we have several other products that might be even better for your specific needs. We invite you to browse the full list here.