The Science Lab
AQUANOX A4618 – Innovation to Enhance Reliability
In the realm of electronics, the ever-increasing challenges associated with thorough and effective cleaning have become more difficult. This cleaning challenge is further heightened by the trend toward smaller devices, the heightened harshness of cleaning standards, and the increased costs associated with process implementation. You want to be able to rely on your assemblies every time and never question their cleanliness or reliability, this is why it is vital to choose the most efficient cleaning processes available. Fortunately, KYZEN has a new cleaning solution that promises to bring your clean to new heights.
AQUANOX A4618, is a carefully crafted cleaning solution designed to address the challenges presented by contemporary lead-free flux residues while delivering pristine, mirror-like solder finishes. This innovative cleaning solution is bringing cutting-edge advancement to the world of electronics. With advanced features like unparalleled flux residue removal capabilities, cost-effectiveness in operations, exceptional compatibility with diverse materials, and enhanced performance even at lower concentrations and temperatures, using A4618 means that you will see exceptional results in no time.
You want to make sure you are getting minimal defects and the highest yield possible, and AQUANOX A4618 provides the peace of mind you need. To learn more about the benefits of A4618, please click HERE. If you want to explore how AQUANOX A4618 can work for your cleaning process, please reach out to a KYZEN Cleaning Expert today. Your search for optimal cleanliness begins with KYZEN.
Cleaning with Water or Cleaning Up After Water’s Damage in Semiconductor Manufacturing Processes?
To say that water is important in most cleaning processes is an understatement. But what happens when water threatens the integrity of the finished product, in this case, semiconductors, when used in a manufacturer’s cleaning process?
Manufacturing semiconductors requires both precision and accuracy to produce products used across industries ranging from communications and computing to healthcare and military systems. Cleaning solely with water can lead to defects and malfunctions because of low pH levels and inherent impurities. This means it isn’t only imperative to identify, test, and carefully select cleaning chemistries for a cleaning process but also how those chemistries interact with water during that process to affect components and substrates.
When qualifying a new cleaning process, or reviewing an existing one, in semiconductor manufacturing it’s recommended that each component be tested with extended water exposure. The extended exposure time simulates multiple cleaning passes while revealing potential issues with compatibility, like inconsistencies in the manufacturing of components or the sensitivity of those components to water.
Sensitive metals like copper, aluminum, nickel, gold, and silver are typically used in the production of components and packages in water-soluble flux applications. And they can be sensitive in water-only cleaning processes due to improper plating and thin metallurgy.
As die sizes increase and gap sizes decrease, wash exposure times must also increase to ensure complete cleaning, which could result in electrical and delamination issues. Using a balanced cleaning chemistry that provides metal protection through multiple wash cycles can help avoid these issues while preventing corrosion on the sensitive metals of which components are made and ensure that components are safe through multiple washes.
When investing in and implementing specialized cleaning solutions developed to address the issues that water-only cleaning processes can create, semiconductor manufacturers can ensure the cleanliness, integrity and long-term reliability of devices that are only becoming more complex.
To learn more, Click Here to read “Compatibility in Semiconductor Cleaning Applications – Could Water be the Problem?” by KYZEN’s Research and Development Chemist Haley Reid published in US Tech in July 2023.