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Solstice® PF

The Effective Vapor Degreasing Solvent with Desirable Environmental Properties

Solstice PF(Solstice Performance Fluid), is a highly effective fluorinated solvent distributed exclusively by KYZEN across most of North America. We highly recommend it for metal degreasing, and oxygen systems cleaning. In fact, Solstice PF is the preferred solvent of NASA for AK225 replacement in their oxygen systems cleaning. It is nonflammable, with favorable toxicity properties (OEL of 800 PPM), a low global-warming-potential of 1, negligible ozone depletion, does not contribute to ground-level smog, and is not a volatile organic compound (VOC) as determined by the U.S. EPA and the South Coast Air Quality Management District (SCAQMD).

Solstice PF is effective on the toughest soils while protecting even the most sensitive parts in metal finishing and oxygen systems cleaning. Solstice PF is safe for all types of metal materials and most plastics.

Solstice PF effectively removes hydrocarbon oils, silicone oils, silicone greases, fluorinated oils, mineral oils, and acrylics. It is a key ingredient in KYZEN’s breakthrough VaporDegreasing 20|20 processes, which clean effectively, while maintaining favorable environmental properties. Solstice PF is formulated so that it will reliably replace your dependence on AK225 and nPb while ensuring that you exceed all HE&S and EPA requirements. It is low odor, recyclable, and offers zero personnel exposure while filling and removing.

Solstice PF is thermally and hydrolytically stable. In one experiment, samples of this solvent, in the presence of water and metals, were stored at 150°C for two weeks. There was:

  • No observed effect on the metals and
  • Analysis showed no indication of breakdown of the Solstice PF
  • Also, samples stored in steel cylinders for several years have been analyzed and found to be in specification.

This combination of properties – solvency, compatibility and wetting – makes Solstice PF extremely versatile cleaning solvent with broad utility for precision parts, medical devices, oxygen systems cleaning, etc.

Solstice® PF-2A

Supports Electronics Assembly Cleaning that’s Safe for Commonly-Used Plastics and Elastomers

Solstice PF-2A is an industry leading fluorinated solvent designed for electronics cleaning. Solstice PF-2A is a solvent blended with 2% methanol. Meets 25 grams-per-liter air quality requirement of California environmental regulations, such as SCAQMD rule 102. Solstice PF-2A is designed to be effective on the toughest soils while protecting even the most sensitive parts in electronic parts cleaning. It is safe for many commonly used plastics and elastomers. When completely submerged in Solstice PF for 2 weeks, plastics including ABS, HDPE, PTFE, PVC and others showed little to no deterioration. After a similar 2 week submersion test, fluoroelastomers, polyurethanes and neoprene elastomers showed excellent performance.

Solstice PF-2A is effective at cleaning acrylics, liquid RMA fluxes, hydraulic fluids and others. It is also one of the key ingredients in KYZEN’s breakthrough VaporDegreasing 20|20 processes, which deliver highly effective cleaning and favorable environmental properties. Solstice PF-2A is formulated so that it will replace your dependence on AK225 and nPb while ensuring that you exceed all HE&S and EPA requirements. It is low odder, recyclable, and offers zero personnel exposure while filling and removing.

Solstice PF-2A is thermally and hydrolytically stable. In one experiment, samples of Solstice Performance Fluid, in the presence of water and metals, were stored at 150°C for two weeks. There was no observed effect on the metals and analysis showed no indication of breakdown of the Solstice Performance Fluid. Also, samples stored in steel cylinders for several years have been analyzed and found to be in specification.

This combination of properties – solvency, compatibility and wetting – makes Solstice PF-2A an extremely versatile cleaning solvent with broad utility in related applications for electronics assembly cleaning.

The information provided herein is believed to be accurate and reliable, but is presented without guarantee or warranty of any kind, express or implied. User assumes all risk and liability for use of the information and results obtained. Statements or suggestions concerning possible use of materials and processes are made without representation or warranty that any such use is free of patent infringement, and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated herein, or that other measures may not be required.

Solstice® PF-HP

Supports Oxygen Line Cleaning for high cleaning performance, non-flammability, low toxicity, and low volatility, to leave a pristine surface.

Solstice® PF-HP (High Performance) is an ultra clean (very low non-volatile residue content), highly-effective, nonflammable cleaning solution, with a favorable toxicity profile and low environmental impact. In 2015, NASA announced it had tested Solstice Performance Fluid (PF), stating it is a “preferred replacement for cleaning and non-volatile residue (NVR) verification sampling of NASA propulsion oxygen systems hardware, ground support equipment (GSE), and associated test systems. Solstice PF-HP is recommended for cleaning and NVR sampling in applications at NASA propulsion test facilities where AK-225G is currently used”. 1 The tests performed by NASA were designed to determine the compatibility of Solstice PF with commonly-used metals and other materials used in its systems. Solstice PF demonstrated good cleaning efficiency (>97 %) and had the most favorable safety, health and environmental profile compared to other cleaning solutions investigated.

It is extremely important to consider the effect on the surrounding area and the safety of individuals who works and come in contact with a cleaning solution. The environmental impact of Solstice PF-HP has been studied and is shown to have negligible ozone depletion and a very low global warming potential (GWP). The MIR also indicates that Solstice PF-HP will create less ground level ozone or smog than ethane. Designated as VOC exempt by the United States EPA and California’s South Coast Air Quality Management District (SCAQMD). Solstice PF-HP does not exhibit any flashpoint or vapor flame limits – it has been determined that it has no vapor flame limits at temperatures up to 100°C in ASTM E 681 testing.

 

1. Replacement of Hydrochlorofluorocarbon-225 Solvent for Cleaning and Verification Sampling of NASA Propulsion Oxygen Systems Hardware, Ground Support Equipment, and Associated test systems; H.D. Burns, M. A. Mitchell, J. H. McMillian, B.r. Farner, S. A. Harper, S.F. Peralta, N. M. Lowery, H.R. Ross, A. Juarez; NASA/GP01502015-218207.

Cybersolv 141-R

Cybersolv 141-RCybersolv® 141-R is a precision cleaner blend of organic solvents that is safe and ready to use for bench-top electronics cleaning. Cybersolv 141-R is effective on a wide variety of soils typically found in electronic assembly and maintenance cleaning applications.

Cybersolv 141-R is a non-flammable solvent-based benchtop cleaning fluid designed to remove rosin, resin, and synthetic polymeric flux residues from electronic circuitry. The mixture of solvents that make up this cleaning fluid are based on the ability to dissolve rosin and low residue flux residues, vapor pressure, stability, and low toxicity. Cybersolv 141-R dissolves the contaminant and then readily evaporates after the cleaning application.

Cybersolv 141-R is designed for bench-top cleaning needs. The product is excellent for spot cleaning and is commonly used to clean solder joints following hand soldering. Cybersolv 141-R has a very low surface tension and can be used to clean narrow traces and under some component gaps. The product is ideally suited for cleaning through-hole and SMT electronic assemblies, connectors, cables and hybrid circuits.

The solvents used in Cybersolv 141-R are non-polar but possess properties for dissolving flux residues. The solvent composition creates a weak intermolecular force arising from polarized multi-poles present in the solvent blend.  These forces induce a dipole-dipole intermolecular interaction that facilitates the rapid dissolution of rosin and resin structures.

The solvents used in Cybersolv 141-R contain mild and low toxicity fluorinated hydrocarbons in combination with organic covalently bonded chlorinated compounds. The solvents that make up Cybersolv 141-R are low in toxicity, low in global warming potential and non-ozone depleting. It contains no CFCs or HAPs.

Cybersolv C8508

Cybersolv C8508CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lead free flux.

Cybersolv C8508 is a non-flammable solvent maintenance cleaning fluid designed to remove flux residues from reflow oven surfaces, wave soldering fingers and pallets. Metal spring loaded fingers are used to hold and track printed circuit boards over a solder bath during the wave soldering process. Prior to soldering, liquid fluxes are applied to the bottom side of the circuit board using foaming and spray application methods. Overspray from the liquid fluxes adheres to wave fingers and pallets. Over time, the over spray flux must be cleaned.

Cybersolv C8508 solvency make-up is engineered with a mixture of oxygenated solvents and water. The solvents are specifically selected based on their affinity for rosin, no-clean and water soluble wave solder flux residues. Wave soldering machines are equipped with a fluid chamber and brushes to removed flux residues following the soldering process. C8508 is used full strength. The composition dissolves the flux residues and dries evenly without the need for a rinse.

Cybersolv C8508 is also effective at cleaning wave soldering pallets. The product is designed to be full strength in immersion systems using spray-under-immersion or ultrasonic agitation. The product is effective at ambient temperatures. If the residues are burnt or charred, heating the solution to 50-60°C improves cleaning performance. Following the cleaning step, the pallets should be rinsed with DI water and dried.

Cybersolv C8544

Cybersolv C8544Cybersolv® C8544 is a solvent cleaner and stripper designed to be used in immersion and manual cleaning applications. Easy to use, C8544 is applied as received and heated in a well-ventilated tank.

Cybersolv C8544 removes oils and grease from industrial, electronics and optic components. It has also proven effective as a powder coat paint stripper and is an environmentally friendly replacement for traditionally hazardous strippers.

Cybersolv C8622

Cybersolv C8622Cybersolv® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used.

Cybersolv C8622 is designed to replace IPA (isopropyl alcohol) for cleaning water soluble and rosin flux residues. C8622 is ideal for use at electronic assembly work benches, spot cleaning, under-stencil printer cleaning and manual stencil cleaning processes.

Cybersolv C8622 solvency make-up is engineered with a mixture of oxygenated solvents and water. The selected solvents are based on their chemical properties to mix with water. The mixture of ingredients forms an azeotrope, which provides for uniform evaporation. Uniform evaporation allows for the stencil cleaning agent to function as a solvent. The cleaning mixture forms a constant boiling and evaporation point.

Cybersolv C8622 is ideally suited for dissolving un-reflowed solder paste during the stencil printing process. C8622 improves stencil printing yields by removing trace solder paste deposits from the stencil aperture. Clean stencils are critically important when high dense stencil patterns. When cleaning the underside of the stencil with Cybersolv C8622, yield improves due to the repeatability of printing the right amount of solder paste printed onto fine pitch leads. Properly cleaned stencils achieve repeatability and reproducibility over time.

Cybersolv C8622 is also used in wipes and with manual ultrasonic stencil cleaning systems. C8622 rapidly dissolves the flux within the solder powder. Dissolving the flux allows the solder powder to release from the stencil aperture. Cybersolv C8622 dries spot free and does not require a water rinsing step.

Cybersolv C8882

Cybersolv C8882Cybersolv® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. Cybersolv C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes.

Cybersolv C8882 is a solvent-based stencil cleaning fluid specifically designed to clean wet solder paste, SMT adhesive and flux residue from stencils (conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees. Cybersolv C8882 dissolves the flux vehicle, which allows solder balls to release from the stencil during the stencil printer wipe sequence. Cybersolv C8882 has a flash point over 60°C and evaporates cleanly from the stencil.

Cybersolv C8882 is effective for use within the following stencil cleaning processes:

  • Understencil Wipe Cleaning – Solvates the flux resin compositions within uncured solder pastes. Effectively cleans and removes solder paste that has a tendency to stick to the aperture walls and bottom of the stencil. Following the wipe process, a dry wipe and vacuum process rapidly dry the stencil following the cleaning process.
  • Hand-wipe, Immersion Stencil and Pallet Cleaning – The selection of solvents used in Cybersolv C8882 effectively remove polar and non-polar soils. Cybersolv C8882 can be used to hand-wipe a stencil following the printing process.
  • Semi-Manual Ultrasonic Stencil Cleaning Systems – Cybersolv C8882 is an effective cleaning agent for use with the GEN3 and SAWA ultrasonic absorption mat stencil cleaning systems.
  • Solvent Stencil Cleaning Spray Systems – Cybersolv C8882 is designed to run in solvent spray-under- immersion and spray-in-air cleaning machines that were commonly designed to clean with IPA. Cybersolv C8882 effectively washes and rinses the stencil.

For optimal stencil cleaning performance, Cybersolv C8882 should be processed “as is” at 100% concentration at ambient temperatures. Cybersolv C8882 wets and rapidly dissolves the flux that holds the solder spheres into a paste. Upon dissolution of the flux, solder balls release from the apertures and drop to the bottom of the cleaning tank. In well-designed stencil cleaning equipment, the solder balls are caught in recirculation filters, greatly extending bath life.

Cybersolv C8882 has no ozone depleting or global warming potential and is non-hazardous. Furthermore, this product does not contain substances prohibited by EU Directive 2011/65/EU, Restriction of Hazardous Substance Directive (RoHS).  Please reference the Cybersolv C8882 Safety Data Sheet for other safety and/or performance considerations.

KYZEN E5314

Kyzen E5314

KYZEN®E5314 is extremely effective on a wide range of soils including raw solder paste and fluxes built up on wave solder pallets yet mild enough on pallet hardware for repeated wash cycles.

KYZEN E5314 is an ultra-low VOC aqueous cleaning product specifically designed to remove non-reflowed solder paste from stencils and solder paste printing hardware. KYZEN  E5314 cleans flux from wave soldering pallets and light oils from assembly equipment and fixtures. This product was not formulated for the removal of uncured adhesives.

Aquanox A4241

Aquanox A4241 Aquanox® A4241 is an innovative aqueous cleaning solution for printed circuit board (PCB) cleaning and stencil cleaning is designed to be effective on the toughest soils while protecting even the most sensitive parts in electronic assemblies from etch or darkening. A4241 is safe for multiple types of metal materials used in Printed Circuit Board (PCB) Cleaning and Stencil Cleaning including bare aluminum and copper.

Aquanox A4241 is a batch cleaning product specifically designed to remove reflowed flux residues and uncured wet solder paste from populated printed circuit assemblies. The A4241 product design is built to perform these two aqueous electronic assembly cleaning tasks with a single product.

A4241 is effective at cleaning most lead-free and tin-lead no-clean, rosin-based, and water-soluble reflowed flux residues on printed circuit board production assemblies. Aquanox A4241 is functional in spray-in-air and spray-under-immersion, and ultrasonic cleaning machines. Aquanox A4241 is formulated as a concentrate with concentration levels being dependent on the soil type and level of impingement energy applied by the cleaning machine. In most applications, A4241 mixture in water ranges from 15-25% with wash times ranging from 5-20 minutes.

During the electronic assembly process, a small percentage of printed circuit cards are rejected due to solder paste being out of alignment during the solder paste printing process. Aquanox A4241 functions as an aqueous product that cleans both wet solder paste and reflowed flux residues that are common when a misprint arises. As such, A4241 finds applications in multifunctional stencil cleaning machines used for both stencil and printed circuit board cleaning.

Aquanox A4241 is engineered with a mixture of oxygenated and polar organic reactive solvents. Functional additives are added to protect metallic surfaces from chemical attack, surface tension reduction to improve wetting and penetration under low gap components, and reduce foam propagation. The combined features engineered into A4241 make for a highly effective batch and stencil cleaning product. Aquanox A4241 is low in odor and contains no hazardous materials. This product has a wide material compatibility window on boards, components, labels and metallic surfaces.