Aquanox® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental safety
Electronic Assembly and Wafer-Level Packaging Cleaning Fluid
Aquanox A4520 is an electronic assembly and wafer-level packaging cleaning fluid. Aquanox A4520 is a concentrated aqueous-based cleaning agent engineered to remove organic acid, rosin and no-clean flux residues. Aquanox A4520 is most effective on organic acid and rosin based flux residues and is best suited for use in batch and inline spray-in-air cleaning machines.
Aquanox A4520 wafer level packaging solvency make-up is engineered with a mixture of oxygenated, bio-based and polar organic reactive solvents. Functional additives lower surface tension, reduce foaming and passivate (reduce interaction with) metallic surfaces. The combined features engineered into Aquanox A4520 make for a highly effective product to clean flux residue under highly dense packages.
Aquanox A4520 wafer level packaging cleaning solution is highly effective at removing organic acid flux residues under flip chip die and bottom termination components. The polar solvents used with this formulation provide strong Van der Waals forces of attraction for organic acid and rosin flux residues. These polar attractive forces and low surface tension provide the ability to penetrate bottom terminations and clean organic acid flux residues at fast throughput rates.
The polar organic reactive solvents elevate the pH toward the alkaline range. To prevent metallized oxidation, the product is engineered with corrosion inhibitors that protect against oxidation. This feature prevents staining to gold pads, aluminum, copper, tin and lead alloys.
Aquanox A4520 concentration is controlled using refractive index or alkaline titration methods. The recommended process temperature range is 55-65°C. The working concentration for cleaning organic acid flux residues typically ranges from 4-6%. The product is delivered to the component bottom terminations using targeted spray nozzles. Bath life is dependent on soil load, drag out and replenishment rates.