Electronic Assembly Cleaning Packages
SMT Stencil Cleaning Series
A clean stencil can be critical.
As PCB assemblies become denser and miniaturization drives electronic component size ever smaller, the more important it has become that solder paste deposits and volume transfer are consistent and reproducible from board to board in the printing process. A number of factors can negatively affect these important attributes. For example, proper solder paste transfer efficiency is especially critical for small pad features, because it reduces defects due to poor solder joints. In this case, solder paste builds up onto the aperture walls and bottom side of the stencil over time leading to insufficient or inconsistent transfer onto the pads. Periodic cleaning of the built-up paste with a KYZEN stencil cleaning fluid designed for your application will improve print quality and process yield.
Watch our Tech 2 Tech stencil cleaning series below to learn more!
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