KYZEN E5631J is a ready-to-use, safe alternative solution to isopropyl alcohol (IPA) for removing raw solder paste from stencils both in online and offline stencil cleaning processes. E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder pastes to make every print count. KYZEN E5631J is proven compatible with common stencils, cleaning equipment, and printer manufacturers. The E5631J is formulated with the worker and environment in mind.

Product Data
Typical Process
Process: Online & Offline Stencil Cleaner
Concentration: Ready to Use
Temperature: Ambient to 120°F/49°C
Rinse: DI Water/Solvent
Dry: Warm Air Recommended
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: None to Boiling
Boiling Point: 212°F / 100°C
Water Soluble: Complete
VOC, @ 100% 131 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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