KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints.

KYZEN E5631 has proven compatible with stencil foil, epoxy adhesives, frames, and mesh as well as the materials of construction found in stencil cleaning equipment. E5631 has favorable GHS and safety ratings. KYZEN E5631 is a non-hazardous, biodegradable aqueous solution that is RoHS compliant and meets all REACH requirements to date.

Product Data
Typical Process
Process: Spray-in-Air & Ultrasonics
Concentration: <25%
Temperature: Ambient to 120°F/49°C
Rinse: Recommended DI Water
Dry: Hot Air
Product Properties
pH (10g/L): N/A (Solvent-Based)
Flash Point: None to Boiling
Boiling Point: 220°F / 104°C
Water Soluble: Complete up to 15%
VOC, @ 10% 87.4 g/L

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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